Utilizing an integrated plasmon detector to measure a metal deposit roughness on a semiconductor surface
US7297966B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | May 11, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/1719
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for monitoring the surface roughness of a metal, comprises impinging a laser beam onto the surface of a metal layer to induce the formation of a plasmon therein, and monitoring a current of decay electrons emitted by the plasmon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.