Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
US7298235B2 · kind B2 · utility
9Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2004 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Dec 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1305
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.