Tse E. Wong
10Patents
5h-index
21Co-inventors
66Inventor score
Filing activity: Apr 3, 1997 → May 3, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5899753A | Spring-loaded ball contact connector | Electricity | 17 | Expired |
| US8921992B2 | Stacked wafer with coolant channels | Electricity | 14 | Active |
| US7298235B2 | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces | Electricity | 9 | Expired |
| US10446466B1 | Mechanically improved microelectronic thermal interface structure for low die stress | Electricity | 7 | Active |
| US7605477B2 | Stacked integrated circuit assembly | Electricity | 5 | Active |
| US9648729B1 | Stress reduction interposer for ceramic no-lead surface mount electronic device | Emerging Cross-Sectional Technologies | 3 | Active |
| US7888176B2 | Stacked integrated circuit assembly | Electricity | 3 | Active |
| US9334154B2 | Hermetically sealed package having stress reducing layer | Performing Operations; Transporting | 1 | Active |
| US9708181B2 | Hermetically sealed package having stress reducing layer | Performing Operations; Transporting | 0 | Active |
| US9706662B2 | Adaptive interposer and electronic apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.