Patent · US Expired

Apparatus for housing a micromechanical structure and method for producing the same

US7300823B2 · kind B2 · utility

9Cited by

13References

3Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martin Franosch · Munich, DE
Andreas Meckes · Munich, DE
Winfried Nessler · Munich, DE
Klaus-Gunter Oppermann · Holzkirchen, DE

Key dates

Filing date	Nov 17, 2004
Grant date	Nov 27, 2007
Priority date	—
Expiry date	Oct 11, 2025

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/977
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.