Package lid or heat spreader for microprocessor packages
US7301227B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2005 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Dec 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provides electrical connections from the IC die to the lower surface of the substrate. The lid includes an outer lid and an inner lid. The inner lid is positioned over the IC die and is in thermal communication with the IC die. The inner lid is formed of a material suitable for conducting heat away from the IC die. The outer lid is attached to the upper surface of the substrate. A gap extends between the outer lid and inner lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.