Electronic chip and electronic chip assembly

US7301779B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Wolfgang Hönlein · Unterhaching, DE
• Franz Kreupl · Mountain View, US
• Werner Simburger · Haar, DE
• Wolfgang Hnlein · Unterhaching, DE

Key dates

• Filing date: Jun 3, 2002
• Grant date: Nov 27, 2007
• Expiry date: Feb 9, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip.