Bond finger on via substrate, process of making same, package made thereby, and method of assembling same
US7302756B2 · kind B2 · utility
1Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2003 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Oct 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.