Chemical mechanical polishing compositions and methods relating thereto
US7303993B2 · kind B2 · utility
5Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Jul 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.