Power distribution within a folded flex package method and apparatus
US7304373B2 · kind B2 · utility
75Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | May 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.