Non-dripping nozzle apparatus
US7306114B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Oct 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the invention, a dispense head for a wafer processing apparatus is provided. The dispense head may include an inlet, at least one outlet, a drain, and a passageway therethrough interconnecting the inlet, the outlet, and the drain. The inlet may be at a first height above a bottom of the passageway, the outlet may be a second height above the bottom of the passageway, and the drain may be a third height above the bottom of the passageway. A first valve may be connected to the inlet, and a second valve may be connected to the drain. When the first valve is opened and the second valve is closed, fluid flows into the inlet and out of the outlet. When the second valve is opened and the first valve is closed, fluid from the passageway flows out of the drain. A pump may be connected to the drain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.