Multi-wire saw
US7306508B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Oct 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.