Seiichi Mimura
10Patents
7h-index
25Co-inventors
62Inventor score
Filing activity: Feb 6, 1991 → Jun 27, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5108955A | Method of making a resin encapsulated pin grid array with integral heatsink | Emerging Cross-Sectional Technologies | 71 | Expired |
| US5433822A | Method of manufacturing semiconductor device with copper core bumps | Electricity | 27 | Expired |
| US5289039A | Resin encapsulated semiconductor device | Electricity | 27 | Expired |
| US7306508B2 | Multi-wire saw | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5179039A | Method of making a resin encapsulated pin grid array with integral heatsink | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5233225A | Resin encapsulated pin grid array and method of manufacturing the same | Electricity | 12 | Expired |
| US8075647B2 | Slurry for slicing silicon ingot and method for slicing silicon ingot using the same | Emerging Cross-Sectional Technologies | 11 | Active |
| US5882418A | Jig for use in CVD and method of manufacturing jig for use in CVD | Chemistry; Metallurgy | 4 | Expired |
| US6700231B2 | Thrust converter, method of controlling the same, and controller for controlling the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8256407B2 | Multi-wire saw and method for cutting ingot | Performing Operations; Transporting | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.