Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US7306637B2 · kind B2 · utility
21Cited by
21References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Feb 12, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1436
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged polyelectrolyte.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.