Method of performing a double-sided process
US7306955B2 · kind B2 · utility
3Cited by
6References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2006 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | May 5, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.