Method and apparatus for manufacturing an optoelectronic device
US7306970B2 · kind B2 · utility
1Cited by
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19Claims
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Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Mar 23, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1438
Abstract
A method for manufacturing an organic electronic device including a stack of layers with a lateral structure on a substrate, at least one of the layers being an organic material layer. A method includes with the step of providing a stamp with at least one protrusion of the surface area corresponding to the lateral structure. The stack of layers is deposited with a first face on the surface area of the protrusion of the stamp. A second face of the stack that is opposite to the first face is brought into adhesive contact with the substrate. The stamp is released from the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.