Wafer bonding with highly compliant plate having filler material enclosed hollow core
US7307005B2 · kind B2 · utility
215Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Jun 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05186
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally deflecting the two wafers; and bonding the raised contacts.The present invention also discloses a bonded-wafer structure that includes: a first wafer, the first wafer being locally deflected, the first wafer including a first raised contact; and a second wafer, the second wafer being locally deflected, the second wafer including a second raised contact, wherein the second raised contact is bonded to the first raised contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.