Scott List
5Patents
4h-index
10Co-inventors
46Inventor score
Filing activity: Oct 9, 2003 → May 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7307005B2 | Wafer bonding with highly compliant plate having filler material enclosed hollow core | Electricity | 215 | Expired |
| US8421225B2 | Three-dimensional stacked substrate arrangements | Electricity | 14 | Active |
| US7973407B2 | Three-dimensional stacked substrate arrangements | Electricity | 8 | Active |
| US8203208B2 | Three-dimensional stacked substrate arrangements | Electricity | 4 | Active |
| US7214605B2 | Deposition of diffusion barrier | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.