Integrated circuit chips and wafers including on-chip test element group circuits, and methods of fabricating and testing same
US7307441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2003 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Nov 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuit chips include an internal circuit including interconnected semiconductor devices that are configured to provide integrated circuit functionality, and a Test Element Group (TEG) circuit that is configured to allow measuring of electrical characteristics of the semiconductor devices. By providing a TEG circuit in the same integrated circuit chip as the internal circuit, the TEG circuit may accurately represent the electrical characteristics of the interconnected semiconductor devices of the internal circuit of the associated integrated circuit chip. The integrated circuit chip may be coupled to a test apparatus. The test apparatus includes a test probe that is configured to simultaneously contact the internal circuit and the TEG circuit. The test apparatus also can simultaneously test the integrated circuit functionality of the internal circuit, and measure the electrical characteristics of the semiconductor devices via the TEG circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.