Micro-optoelectromechanical system packages for a light modulator and methods of making the same
US7307773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2005 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Apr 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N5/7458
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid, gel or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.