Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US7307775B2 · kind B2 · utility
19Cited by
34References
161Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2002 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Feb 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.