Hung-Nan Chen
5Patents
3h-index
16Co-inventors
50Inventor score
Filing activity: Aug 27, 1999 → Apr 25, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7307775B2 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Electricity | 19 | Expired |
| US6234029A | Testing module for testing the strength of the welding area on a PCB | Physics | 4 | Expired |
| US7384566B2 | Fabrication method for printed circuit board | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8247879B2 | Micromechanical device with microfluidic lubricant channel | Electricity | 1 | Active |
| US7932569B2 | Micromechanical device with microfluidic lubricant channel | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.