Stacked module systems and methods
US7310458B2 · kind B2 · utility
13Cited by
306References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 25, 2005 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Apr 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be employed with CSP devices of a variety of configurations either with or without form standards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.