James Wehrly
53Patents
18h-index
20Co-inventors
84Inventor score
Filing activity: Sep 28, 1989 → Jan 20, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7053478B2 | Pitch change and chip scale stacking system | Electricity | 113 | Expired |
| US6576992B1 | Chip scale stacking system and method | Electricity | 109 | Expired |
| US5078852A | Plating rack | Chemistry; Metallurgy | 98 | Expired |
| US5135636A | Electroplating method | Emerging Cross-Sectional Technologies | 92 | Expired |
| US6914324B2 | Memory expansion and chip scale stacking system and method | Electricity | 76 | Expired |
| US7026708B2 | Low profile chip scale stacking system and method | Emerging Cross-Sectional Technologies | 69 | Expired |
| US7033861B1 | Stacked module systems and method | Emerging Cross-Sectional Technologies | 69 | Expired |
| US6956284B2 | Integrated circuit stacking system and method | Electricity | 65 | Expired |
| US6462408B1 | Contact member stacking system and method | Electricity | 48 | Expired |
| US7094632B2 | Low profile chip scale stacking system and method | Emerging Cross-Sectional Technologies | 39 | Expired |
| US7289327B2 | Active cooling methods and apparatus for modules | Electricity | 36 | Expired |
| US7180167B2 | Low profile stacking system and method | Electricity | 31 | Expired |
| US7595550B2 | Flex-based circuit module | Electricity | 29 | Expired |
| US6940729B2 | Integrated circuit stacking system and method | Electricity | 27 | Expired |
| US4945954A | Method and apparatus for aligning mating form tools | Emerging Cross-Sectional Technologies | 27 | Expired |
| US7616452B2 | Flex circuit constructions for high capacity circuit module systems and methods | Electricity | 25 | Active |
| US5210936A | Method and apparatus for the excise and lead form of TAB devices | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7443023B2 | High capacity thin module system | Electricity | 19 | Active |
| US5283946A | Method and apparatus for forming metal leads | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7446410B2 | Circuit module with thermal casing systems | Electricity | 15 | Active |
| US7310458B2 | Stacked module systems and methods | Electricity | 13 | Expired |
| US7626259B2 | Heat sink for a high capacity thin module system | Electricity | 12 | Active |
| US7719098B2 | Stacked modules and method | Emerging Cross-Sectional Technologies | 10 | Active |
| US7468553B2 | Stackable micropackages and stacked modules | Electricity | 9 | Active |
| US6806120B2 | Contact member stacking system and method | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.