Thermal interface material and electronic assembly having such a thermal interface material
US7311967B2 · kind B2 · utility
17Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2001 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jan 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31692
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.