System for ultraviolet atmospheric seed layer remediation
US7312151B2 · kind B2 · utility
2Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2006 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jan 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.