Low temperature phase change thermal interface material dam
US7312527B2 · kind B2 · utility
13Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2005 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Dec 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.