Chip packaging systems and methods
US7314777B2 · kind B2 · utility
2Cited by
18References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2004 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Nov 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.