Metal resistor, resistor material and method
US7314786B1 · kind B1 · utility
14Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Jun 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W88/18
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A metal resistor and resistor material and method of forming the metal resistor are disclosed. The metal resistor may include an infused metal selected from the group consisting of: copper (Cu) infused with at least one of silicon (Si), nitrogen (N2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W), and aluminum infused with at least one of silicon (Si), nitrogen (N2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W). The method is less complex than conventional processes, allows control of the resistance by the amount of infusion material infused, and is compatible with conventional BEOL processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.