Microelectronic device interconnects
US7314817B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2005 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Jun 22, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.