System and method for inspecting wafers in a laser marking system
US7315361B2 · kind B2 · utility
4Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2005 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Nov 26, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An illumination system is disclosed for use in a semiconductor wafer back side inspection assembly. The illumination system includes an illumination source that is configured to direct illumination toward a highly reflective and directionally reflective surface at an angle α of about 45 degrees to about 75 degrees with respect to the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.