Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
US7316977B2 · kind B2 · utility
4Cited by
18References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2006 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Aug 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a ketoxime compound and water. The composition may also contain an abrasive and/or a per compound oxidizing agent. The composition affords tunability of removal rates for metal, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.