Thermal interface apparatus, systems, and fabrication methods
US7317258B2 · kind B2 · utility
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22References
8Claims
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Key dates
| Filing date | Mar 6, 2006 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Mar 6, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1438
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.