Method and system of trace pull test
US7319043B2 · kind B2 · utility
7Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Nov 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13024
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.