Method of manufacturing an electronic parts packaging structure
US7319049B2 · kind B2 · utility
26Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the electronic parts, and obtaining an insulating layer, in which the electronic parts is embedded, by curing the first uncured resin layer and the second uncured resin layer by annealing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.