Apparatus for treating substrate
US7323080B2 · kind B2 · utility
18Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.