Patent · US Expired

Mounting method for a semiconductor component

US7323359B2 · kind B2 · utility

1Cited by

7References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Lenz · Zorneding, DE
Ralf Otremba · Kaufbeuren, DE
Herbert Roedig · Riemerling, DE

Key dates

Filing date	Jul 29, 2004
Grant date	Jan 29, 2008
Priority date	—
Expiry date	Jan 27, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one contact/mounting element made of semiconductor material and/or metal and/or insulator material to the solder material, heating of at least one part of the semiconductor component to a temperature lying above the melting point of the solder material by impressing an electrical power into the semiconductor component, as a result of which corresponding soldering connections arise between the semiconductor component and the at least one contact/mounting element, and cooling of the connection complex that comprises the semiconductor component and at least one contact/mounting element and was produced in the preceding step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.