Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
US7323362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Mar 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system (100) for manufacturing product, in which a first work station (101) is operable to perform a first manufacturing action on the product parts; this first station has a first entrance (101a) and a first exit 101b). A second work station (102) is operable to perform a second manufacturing action on the product parts; this second station has a second entrance (102a) and a second exit (102b). A transport line (103) between the first exit and the second entrance is operable to move the product parts under computer control. A chamber (104) encloses a portion of the line and is constructed so that the transport achieves a balanced throughput from the first station to the second station, while the product parts are exposed to computer-controlled environmental conditions (110) during transport through the chamber. The balanced throughput in the chamber is achieved by waiting lines for the product with computer-controlled monitors (105a) for product parts' positions and times in the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.