Inventor · McKinney, TX, US

Charles Odegard

15Patents
4h-index
11Co-inventors
53Inventor score

Filing activity: Sep 14, 2001 → May 21, 2012

Most-cited inventions

PatentTitleAreaCited byStatus
US6869831B2 Adhesion by plasma conditioning of semiconductor chip surfaces Electricity 25 Expired
US6798212B2 Time domain reflectometer probe having a built-in reference ground point Physics 11 Expired
US6855578B2 Vibration-assisted method for underfilling flip-chip electronic devices Electricity 6 Expired
US7224071B2 System and method to increase die stand-off height Emerging Cross-Sectional Technologies 6 Expired
US7319275B2 Adhesion by plasma conditioning of semiconductor chip Electricity 3 Expired
US7598124B2 System and method to increase die stand-off height Emerging Cross-Sectional Technologies 2 Active
US7550314B2 Patterned plasma treatment to improve distribution of underfill material Electricity 2 Active
US6977429B2 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices Electricity 2 Expired
US7393719B2 Increased stand-off height integrated circuit assemblies, systems, and methods Emerging Cross-Sectional Technologies 2 Expired
US7323362B2 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices Electricity 1 Expired
US7276401B2 Adhesion by plasma conditioning of semiconductor chip surfaces Electricity 1 Active
US7045904B2 Patterned plasma treatment to improve distribution of underfill material Electricity 1 Expired
US7271494B2 Adhesion by plasma conditioning of semiconductor chip surfaces Electricity 0 Expired
US7445960B2 Adhesion by plasma conditioning of semiconductor chip Electricity 0 Active
US8674504B2 Wire-based methodology of widening the pitch of semiconductor chip terminals Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.