Method for manufacturing semiconductor device and heat treatment method
US7323368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to apply a technique for removing the adverse effect of a substrate shrinkage due to a heat treatment, and further forming a fine and high-quality insulating film, and a semiconductor device that can realize high-performance and high-reliability by using the same, to a transistor formed by laminating a semiconductor film or an insulating film over a glass substrate.A heat treatment that is necessary in a step of forming a thin film element by laminating a semiconductor film or an insulating film over a glass substrate is performed without thermally-damaging the substrate. For the purpose, a light-absorbing layer that can absorb pulsed light over a particular portion of the substrate in which the thin film element is formed is locally formed, and the heat treatment is performed. A semiconductor layer or an insulating layer is disposed between the light-absorbing layer and the substrate, and thus, the portion overlapping with the light-absorbing layer is selectively heated to high temperature and the heat treatment can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.