Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
US7323406B2 · kind B2 · utility
14Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Dec 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making novel elevated bond-pad structures with sidewall spacers is achieved. The elevated bond-pad structures increase the space between the chip and a substrate during flip-chip bonding. The increased spacing results in better under-filling and reduces alpha particle soft errors in the chip. The sidewall spacers restrict the wetting surface for the PbSn solder bumps to the top surface of the bond pads. This results in smaller solder bumps and allows for closer spacings of the array of bonding pads for higher density integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.