Magnetoresistive sensor element and method of assembling magnetic field sensor elements with on-wafer functional test
US7323870B2 · kind B2 · utility
108Cited by
11References
14Claims
0Family size
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Key dates
| Filing date | Feb 23, 2006 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Feb 23, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2829
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of performing an on-wafer function testis provided for multiple magnetic field sensor elements on a wafer. Each sensor element includes a magnetic-field-sensitive structure and a current conductor structure. The current conductor structure provides a test magnetic field in response to a test signal, and a change in an electrical characteristic of the respective magnetic-field-sensitive structure is sensed. The functionality of the respective magnetic field sensor element is then evaluated based on electrical characteristic change.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.