Flow through cooling assemblies for conduction-cooled circuit modules
US7324336B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Jan 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.