David L. Vos
25Patents
8h-index
26Co-inventors
75Inventor score
Filing activity: Jun 4, 1996 → Aug 9, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9510479B2 | Fluid-cooled module for integrated circuit devices | Electricity | 74 | Active |
| US6330152A | Apparatus facilitating use of cots electronics in harsh environments | Performing Operations; Transporting | 52 | Expired |
| US6002588A | Thermally conductive vibration isolators | Mechanical Engineering; Lighting; Heating | 49 | Expired |
| US7995344B2 | High performance large tolerance heat sink | Electricity | 40 | Active |
| US7324336B2 | Flow through cooling assemblies for conduction-cooled circuit modules | Electricity | 24 | Expired |
| US9426931B2 | Fluid-flow-through cooling of circuit boards | Emerging Cross-Sectional Technologies | 11 | Active |
| US6151216A | Thermally conductive vibration isolators | Mechanical Engineering; Lighting; Heating | 10 | Expired |
| US7203574B2 | Self-sustaining environmental control unit | Emerging Cross-Sectional Technologies | 9 | Expired |
| US8730673B2 | Fluid-cooled module for integrated circuit devices | Electricity | 8 | Active |
| US10527362B2 | Integrated multi-chamber heat exchanger | Emerging Cross-Sectional Technologies | 4 | Active |
| US10371462B2 | Integrated multi-chamber heat exchanger | Electricity | 4 | Active |
| US8847823B2 | Dimensionally tolerant multiband conformal antenna arrays | Electricity | 3 | Active |
| US10461018B2 | Integrated multi-chamber heat exchanger | Electricity | 3 | Active |
| US7719108B2 | Enhanced reliability semiconductor package | Emerging Cross-Sectional Technologies | 2 | Active |
| US7670877B2 | Reliability enhancement process | Emerging Cross-Sectional Technologies | 1 | Active |
| US10914535B2 | Integrated multi-chamber heat exchanger | Electricity | 1 | Active |
| US10816280B2 | Integrated multi-chamber heat exchanger | Emerging Cross-Sectional Technologies | 1 | Active |
| US10548243B2 | Process for installing an insert for fluid-flow-through cooling of circuit boards | Emerging Cross-Sectional Technologies | 1 | Active |
| US7272468B2 | Self-sustaining environmental control unit | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10923876B1 | Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof | Electricity | 0 | Active |
| US10362713B2 | Process for making an apparatus with fluid-flow-through cooling of circuit boards | Emerging Cross-Sectional Technologies | 0 | Active |
| US9389103B1 | Sensor array packaging solution | Physics | 0 | Active |
| US9851161B2 | Heat exchanger construction using low temperature sinter techniques | Emerging Cross-Sectional Technologies | 0 | Active |
| US6479931B1 | Extended temperature range fluorescent lamp | Electricity | 0 | Expired |
| US9673514B2 | Dimensionally tolerant multiband conformal antenna arrays | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.