Patent · US Expired

Methods for packaging of a semiconductor light emitting device

US7326583B2 · kind B2 · utility

53Cited by
29References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 27, 2005
Grant dateFeb 5, 2008
Priority date
Expiry dateOct 12, 2025

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/852

Abstract

Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.