Methods for packaging of a semiconductor light emitting device
US7326583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
Abstract
Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.