Optical semiconductor package with incorporated lens and shielding
US7327005B2 · kind B2 · utility
10Cited by
23References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semiconductor component, and includes a window allowing light to pass through it toward the optical sensor. An optical lens (17) is disposed in the cavity (6) between the optical sensor (10) and the window (5). A support structure (18) supports the optical lens. This optical semiconductor module may also include a shield (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.