Nanoparticle filled underfill
US7327039B2 · kind B2 · utility
26Cited by
26References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2003 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/305
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.