Defect inspecting method, defect inspecting apparatus and inspection machine
US7327871B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2004 |
| Grant date | Feb 5, 2008 |
| Priority date | — |
| Expiry date | Jun 13, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to a defect inspecting method implemented in a semiconductor circuit inspection machine, a difference in a gray-scale level of a pattern edge image is corrected. A procedure of determining a magnitude of correction is modified in efforts to improve the sensitivity in detecting a defective pattern edge image. A defect inspecting system comprises: an image alignment unit that detects a sub-pixel deviation of two images, which are objects of inspection, from each other; and a magnitude-of-correction determination unit that determines a magnitude of correction, by which the difference in a gray-scale level of a pattern edge image between the two images that is detected by the difference detector is corrected, according to the detected sub-pixel deviation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.