Semiconductor wafer processing machine
US7329079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2004 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Mar 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.