Integrally packaged imaging module
US7329861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2003 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Aug 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.