I/O architecture for integrated circuit package
US7329946B2 · kind B2 · utility
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6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2005 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Feb 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive elements of an integrated circuit die, and the second conductive elements may receive a first plurality of the input/output signals from respective ones of the first conductive elements. A lower surface of the package may include third conductive elements, the third conductive elements to receive a second plurality of the input/output signals from respective other ones of the first conductive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.